Clinical Comparison of Different Adhesives in NCCLs

Hacettepe University

Status: Active, not recruiting

Conditions: Tooth Wear

Treatments: Device: Tetric N-Bond; Device: Clearfil Universal Bond Quick; Device: Clearfil SE Bond

Study type: Interventional

Funder types: Other

Identifiers

NCT04481087

NCCLs universal

Details and patient eligibility

About

The aim of this randomized, controlled, prospective clinical trial is to evaluate the performances of a universal adhesive in three different application modes, a self-etch adhesive and an etch&rinse adhesive in restoration of non-caries cervical lesions. Thirty-four patients will receive restorations. Lesions will be divided into 5 groups according to adhesive systems and application modes: CU-SE: Clearfil Universal Bond Quick in self-etch mode, CU-SLE: Clearfil Universal Bond Quick in selective etch mode, CU-ER: Clearfil Universal Bond Quick in etch&rinse mode, CSE: Clearfil SE Bond, TB: Tetric N-Bond. Restorations (Tetric N-Ceram composite) will be scored with regard to retention, marginal discoloration, marginal adaptation, recurrent caries and post operative sensitivity using modified USPHS criteria after 48 months. Two examiners who is not involved in the placement of restorations will conduct the evaluations. Descriptive statistics will be performed using Chi-square tests.

Enrollment: 34 patients

Sex: All

Ages: 18 to 65 years old

Volunteers: Accepts Healthy Volunteers

Inclusion criteria

• being 18 years or older,
• having no medical or behavioral problems preventing then from attending review visits,
• having at least 5 tooth with NCCLs
• having antagonist teeth

Exclusion criteria

• poor gingival health,
• uncontrolled, rampant caries,
• bruxism,
• removable partial dentures,
• xerostomia

Trial design

Primary purpose: Treatment

Allocation: Randomized

Interventional model: Parallel Assignment

Masking: Single Blind

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34 participants in 5 patient groups

Clearfil Universal Bond Quick, self-etch mode (CU-SE)

Experimental group

Treatment:

Device: Clearfil Universal Bond Quick

Device: Clearfil Universal Bond Quick

Device: Clearfil Universal Bond Quick

Clearfil Universal Bond Quick, selective etch mode (CU-SLE)

Experimental group

Treatment:

Device: Clearfil Universal Bond Quick

Device: Clearfil Universal Bond Quick

Device: Clearfil Universal Bond Quick

Clearfil Universal Bond Quick, etch&rinse mode (CU-ER)

Experimental group

Treatment:

Device: Clearfil Universal Bond Quick

Device: Clearfil Universal Bond Quick

Device: Clearfil Universal Bond Quick

Clearfil SE Bond (CSE)

Experimental group

Treatment:

Device: Clearfil SE Bond

Tetric N-Bond (TB)

Experimental group

Treatment:

Device: Tetric N-Bond